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PCB Application
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Application process
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After stencil printing, after/before hot air reflow
Can test both sides and multiple PCBs simultaneously
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PCB dimension
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20×20mm-450×350mm
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PCB thickness
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0.3-5.0mm
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PCB space
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top：≤30mm；bottom:≤45mm
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Inspection
items
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After stencil printing
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Solder paste unavailability, insufficient or excessive solder paste, solder paste misalignment, solder paste bridging, stain , scratch and so on.
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Before or after reflow soldering
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Missing or excessive component, misalignment, uneven, edging defect, opposite mounting , wrong polarity, wrong or bad components.
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Before or after DIP wave soldering
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Excessive or missing component, empty soldering, solder balls, solder misalignment, edging defect, bridging, IC NG, copper stain etc.
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Visual system
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Image system
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CCD camera, German Basler 500 million px
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Lighting system
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Three-channel white led light source or RGB light source
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Resolution ratio
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18um(FOV dimension：28.8 mm×21.6 mm)
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Inspection mode
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Color calculation, color extraction, gray-scale operations, image matching, etc
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Mechanical system
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X/Y driving system
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AC servo motor, Precision grinding ball screw
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PCB fixing mode
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Auto fixture
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Positioning accuracy
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<8 um
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Moving speed
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800mm/s(MAX)
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Orbital adjustment
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Manual
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Software system
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Computing system
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EKT780 configuration
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Interface language
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Chinese/English optional
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Inspection output
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PCB ID, PCB description, component description,defect description, defect image
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Power
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AC220±10%，50/60HZ,1KW
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Operation temperature
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-10-40℃
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Operation humidity
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20-90%RH non condensing
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Machine dimension
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900×1100×1300mm
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