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Inspection system
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Application
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After stencil printing, after/before reflow oven, after/before wave soldering
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Program mode
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Manual programming, auto programming, CAD data importing
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Inspection Items
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Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc.
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Component defect: missing or excessive component, misalignment, uneven, edging, opposite mounting, wrong or bad component etc.
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DIP: Missing parts, damage parts, offset, skew, inversion,etc
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Soldering defect: excessive or missing solder, empty soldering, bridging, solder ball, IC NG ,copper stain etc.
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Calculation Method
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Color calculation, color extraction, gray scale operation, image contrast
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Inspection mode
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PCB fully covered, with array and bad marking function
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SPC statistics function
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Fully record the test data and make analysis, with high flexibility to check production and quality status
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Minimum component
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Missing parts, damage parts, offset, skew,sideways
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Optical system
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Camera
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full color high speed industrial digital camera
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Lens resolution
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10um/15um/18um/20um/25um, can be custom-made
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lighting source
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Annular stereo multi-channel color light, RGB/RGBW/RGBR/RWBR optional
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Computer system
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Configuration
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Ekt 600 Custom configuration
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Mechanical system
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Moving and inspection mode
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Y servo motor driving PCB, X servo motor driving camera
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PCB dimension
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20*20mm(Min)～450*330mm(Max)， can be custom-made
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PCB thickness
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0.3～5.0mm
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PCB weight
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Max：3KG
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PCB edge
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3mm，can be custom-made base on need
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PCB bending
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＜5mm or 3% of PCB Diagonal length
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PCB component height
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Top：35mm，Bottom：75mm
Adjustable,can be custom-made base on need
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XY driving system
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AC servo motor, precise ball screw
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XY moving speed
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Max：830mm/s
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XY positioning accuracy
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≦8um
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General parameters
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Machine dimension
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L900 * W1100 * H1400 mm
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Power
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AC220V，50/60Hz，1.2KW
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PCB height from ground
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900±20mm
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Machine weight
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550KG
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Safety standard
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CE safety standard
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Environment temperature and humidity
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10～35℃，35～80％ RH
(non condensing)
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