| Detection capabilities |
Applicable process |
SMT solder paste after printing, SMTBefore reflow soldering/ After,DIP before wave soldering/After |
| Programming mode |
Manually written, CAD data imported and automatically corresponds to the component library |
| Detection type |
Solder paste printing: presence, offset, less tin, more tin, open circuit, even tin, pollution, scratches, etc. |
| Defects in parts: missing parts, multiple parts, offset, skewed, monumental, sideways, turned, wrong, damaged, reversed, etc. |
| Solder joint defects: more tin, less tin, virtual soldering, tin, glue overflow, unpinned, copper foil pollution, etc. |
| Calculation method: |
Color operation, color extraction, grayscale operation, image comparison, OCV/OCR, etc |
| Detection mode |
Optimized detection technology covering the entire circuit board, including Bad mark function |
| SPC statistical function |
The test data is recorded and analyzed throughout the process, and the production status and quality analysis can be viewed in any area |
| Part angle |
Support 0~359° rotation, minimum 1°Angular spacing |
| Minimal parts |
0201 chip、0.3 pitch IC |
| Optical configuration |
camera |
5 million pixel full color high-speed industrial digital camera |
| Lens resolution |
10um/15um/18um/20um/25um, can be customized for special applications |
| light source |
Annular stereo multi-channel color light, depending on the application, RGB/RGBW/RGBR/RWBR, optional coaxial light source |
| Computer |
operating system |
Windows XP 32-bit |
| display |
22 inches, 16:10 |
| VGA |
Intel HD integrated graphics (optional discrete graphics). |
| CPU |
Intel Core |
| RAM |
4GB |
| HDD |
500GB HDD |
| Software systems |
Interface language |
Optional interface in Chinese and English |
| Operational permissions |
Administrator, programmer, operator three-level login permission control |
| Mechanical systems |
Shipping and testing methods |
Manual pick-and-place plate, YServo motor movementPCB， The X-servo motor drives the camera to take pictures |
| Splint method |
Automatic fixtures |
| PCB size |
20*20mm(Min)～400*350mm(Max)， It can be customized for special applications |
| PCB thickness |
0.3～5.0mm |
| PCB weight |
Max：3KG |
| PCB edges |
3mm, can be customized for special applications |
| PCB curvature |
<<b10>or PCB3% of the diagonal length |
| PCB part height |
Top：35mm，Bottom：75mm。 Adjustable, customizable for special applications |
| XY drive system |
AC servo motor, precision grinding ball screw |
| XY movement speed |
Max：830mm/s |
| XY positioning accuracy |
≦8um |
| Parameters of the whole machine |
Device dimensions |
L1120 * W900 * H1400 mm |
| power supply |
AC220V，50/60Hz，1.2KW |
| The height of the PCB above the ground |
820±20mm |
| Device weight |
400KG |
| Equipment safety regulations |
CE safety compliant |
| Ambient temperature and humidity |
10～35℃，35～80％ RH(no condensation). |
| Matching |
Repair station system, offline programming system, SPC server system, barcode identification system |
