EktionAOI Programming Considerations
2018-01-09 19:26
-Ektion AOI equipment manufacturer engaged in the design, production, sales and service of electromechanical equipment (AOI, aoi automatic optical detector, aoi visual detector, tin slag reduction machine, SMT peripheral products and motor automatic tester)
Introduction to AOI Inspection Principle
1. CHS system principle description: the extraction method of the welding pad the extraction of the plane part: only the extraction of the slow inclined surface of the reflected red light: only the extraction of the sharp inclined surface of the reflected green light: only the extraction of the reflected blue light
2. Environment setting screen limit setting: there are configuration user interface setting and extraction confirmation user limit setting password setting: there are administrator, tester, programmer and hardware maintenance repairman machine type permission setting new machine time setting: new machine general Japanese time, should be changed to local standard time language setting: default support for three languages: F10-Japanese F11-English F12-Chinese, with Korean inside, however, you need to enter the settings to replace one of the above three types.
3. File Network Setup Archive Address Component Library: Local and Network Checker: Local NET: Network Remarks: Note the difference with CTS Setup Backup
II: Basic knowledge of programming mode
1. New inspection program: The new program name circuit board is input horizontally and vertically (measured first with a ruler). The track width is 0.5mm larger than the actual clamping amount. Generally, the default "left front" is set to 0.5mm. Depending on the situation, the reference position photographic size component library name photographic magnification is generally 10um. The smaller the value, the higher the resolution, and the larger the 1280*1024 of the captured graphics, the existing ones can be used, you can also create a new note: under normal circumstances, the three items of photographic magnification, photographic size and component library name will remain unchanged.
2. Brief introduction of component frame The automatic extraction frame is mainly used for positioning the component position during local deformation of PCB board passing through the furnace. The size of the component subject frame is determined according to the bending condition of the board. The pad frame includes the positioning frame and the detection frame. The mounting frame is generally placed in the middle of the component. It does not need to be too large. Note: MARK positioning is used for PCB board first, after selecting the right component, use the automatic extraction frame to position the component before inspection.
3. The automatic extraction frame has a power level of 15% by default. If the test shows that the component body and the pad report an error, see if it is necessary to debug the extraction method. If the pad is extracted and the component is extracted, the pad will be located first, and then the other component frames will be brought to a fixed position. Note: If the pad is seen, all the pads in the frame are estimated to be covered, otherwise, the subsequent pad test parameters will report an error. The component is drawn out with the component body and the electrode. Remarks: If the component electrode is drawn out, the "electrode" above must be selected.
4. The less red in the central part of the solder, the better. The less blue in the peripheral part of the solder, the better. The less blue in the central part of the solder, the better. The center of gravity of the solder indicates the distance between the center of the pad and the center of the electrode part of the components with electrical grade. The larger the value, the better. Remarks: For some electrodeless components such as diode gallbladder capacitors, when making the pad frame, attention should be paid to the size of the covered pad, otherwise the vertical offset of the "abnormal solder invasion" alarm bad pad will generally be set at 60%. the lateral offset of the pad will generally be set at 60%. the welding forming angle will generally be set at 60%. this parameter is mainly used to detect the color parameter of less tin. if blue and blue are set greater than a certain%, the PASS pad invasion solder will only set the brightness in the color parameter. the central part will not draw red red is less than a certain% to PASS
5. The area of the mounted frame component is mainly extracted from the color of the test frame. Note that the "binarization" circuit board area setting method is used to limit the area on the opposite side of the component area. It will be stricter after the color angle limit inside the test ring is checked.
6. The editing default of IC is that the pin spacing (mm) between the two frame IC component body frame and the IC automatic extraction frame can be gradually expanded by "window information" and "size" to measure the pin number direction. The default is counterclockwise. Note: The first frame of the pin should be set at the counterclockwise starting position, such as setting the rear position, automatically copying other pins will cause errors. Pins are generally not numbered, such as required numbers, which can better facilitate statistics on specific pin problems, however, this method takes more time. If the pin number increment range is set to 0, it will increase by 1 2 3 4. If it is set to 1, it will increase by 1 3 4 5. If other data are set to change in sequence, the number of check pins is the number of pins that need to be copied on the back side of the first pin set counterclockwise. Note: This data is not accurate for the automatic extraction box of IC. If the extraction box is properly enlarged, the specific number of pins must be set, otherwise, the automatic replication of IC pins may be divided into pin root extraction and pin edge extraction according to the pin spacing and the extended frame, I .e. the longitudinal position of the bridge setting pin is divided into pin root extraction and pin edge extraction, I .e. starting from the first pixel line at the pin root, the red color is above 50% and 4-6 pixel lines appear continuously. if the pin edge extraction is the same as the middle color at the root, edge extraction remarks are required: the pin edge extraction setting only grasps the brightness. At this time, the pin automatically draws the thick frame to the component body frame a little, so as to find the horizontal position of the thick color pin extraction. There are three extraction methods. Generally, the default "overall extraction method" pin front end extraction is that if the front end of the pin is not in place, the front pad extraction algorithm will be automatically found after definition: extract red "binarization" from the outermost side of the IC automatic extraction frame opening to display to white, that is, extract OK longitudinal offset pixel 3, less than 3 pixels from the front of the pad to report errors, lateral offset pixel 3, and less than 3 pixels from the bottom of the pad to report errors, solder bridging except area pixel 7, that is, 7 pixels from the pin root to the outside, the smaller the width of the unexpected short-circuit area, the narrower the welding angle inspection. The front end of the area pin and the solder length pin are too close to the front pad, and the welding forming angle of the small side end is mainly aimed at the IC pin with wide pad and narrow pad. The front end of the IC pin is infiltrated with solder and the front end of the IC pin draws out blue + brightness.
Three: CAD processing and import
1. Excel documents organize the five items of X Y angle position item data, pay attention to the following points: there cannot be special characters such as# * in the item column. if the number package is included, it is better to remove the standard two columns in CSV (comma separated) mode when saving, and there is no special restriction on the order of the five columns of data merged into the same column.
2. Multiform conversion tool software Input file five columns of sorted data csv document location note: this file is a file type ending in. csv Output file using Multiform software to sort out OK can be used for OMRON AOI direct use file location note: this file is a file type ending in. cad offline programming placement address: c:program file\OMRON\CTS\cadfile\*. CAD online test placement address: c:program file\OMRON\VT-RNS\cadfile\*.ca Note: *.csv and *.cad should have the same name. Generally, PCB name(16 charctor) PCB board name PCB size(mm) X horizontal dimension Y vertical dimension Alignment(mm) is generally the default, don't debug Divides by field according to columns Comma commas must be ticked between Excel columns hidden in the Tab text separated by commas 8 spaces generally go to the default value do not tick Divides by fixed according to a fixed length this generally does not use x coordinates x axis direction matching column Revised value 1 X compensation value generally choose Mul multiplied y coordinates Y axis direction matching column Revised value 1 Y compensation value generally choose Mul to multiply. Note: each test point in the X-Y axis direction should be placed in the same quadrant. If not, the overall offset can be used to change the center point for addition or subtraction. When Excel is used to add or subtract the whole column, replace the column Revised value 1 matching the angle of Mount angle in the original column. Add is generally selected to add the angle compensation value. Note: The angle data should be all positive values, no "-" negative sign Componet column matching name position Componet No. item matching column Edder skip jumps from which row of the following data, sometimes the first row is the topic, so you need to set "1" to jump to the first row. generally, OK should be zero here, conversion conversion cannot be set casually. After the above settings are OK, CSV is converted to CAD file "OK"
3. TIMap CAD file inspection software is mainly to check whether the converted CAD file position direction, size and angle are correct PCB name PCB name PCB size PCB size PCB size note: if the position is incorrect, the longitudinal position can be Position in the Standerd in the Multiform conversion tool software. Front Front Rear Latch direction horizontal direction Left Right Right Right Right in the above direction is debugged OK before importing into TIMap software to check note: if the direction is incorrect, the value 1 angle compensation value can be Revised in the column matching the Mount angle angle in the Multiform conversion tool software. Generally, Add is selected and added. After compensating the correct angle, it is imported into TIMap software for viewing.
4. CAD Document Import Test Program Import Sequence: select CAD mode → open CAD file → select product number correspondence table → adjust all positions → align with center position → adjust position (1000 times 100 times 10 times 1 times) → add black row components that have not yet turned blue → paste all → move individual components to test whether the position is accurate → copy circuit board → MARK setting → save product number correspondence table selection if there is no product number correspondence table before or if required another creation should be newly added, that is, the CAD file should be newly associated with the edited component in the component library: append in group → Copy → Copy the new component standard Default to the add group → Click the product number to log in → Associate the component type with the item number or position in CAD → The association of the new component will turn blue Note 1: If the component type is the same, you can directly select the component type, and then click the product number to log in, you can add OK, but after adding, you need to check whether its direction is correct, incorrect, and the rotation change (there is a "CAD component image" on the left at the bottom). If there is no same component in the component type, you can find a similar one. According to the component editing method, copy the new name, set OK to the color, etc., and select the component to be associated in the association, according to the above "new" method connection can be noted 2: capacitor generally if the package electrode and body color are the same, multiple items can be associated with the same component type note 3: in general, the resistor is named using the package and MARK identifier, and the capacitor is named using the item number for later association note 4: before pasting all the components, check whether there are any newly added or copied component frames in the whole circuit board. If there are any, delete them. Otherwise, the component frames will be repeated after pasting all the components, wasting test time and disturbing the test program. Note 5: After clicking "Product Number Login", there will be a "Reference Direction Rotation". At this time, the large "Camera Image" direction and large picture will be required, whether the direction of the following "CAD component image" is consistent and inconsistent. Note 6: Check whether the test position of moving a single component is accurate after pasting all of them. Only single debugging can be performed, not in "single board-circuit board" → circuit board → moving. This is the overall adjustment.
5. Multi-connection board replication If it is two panels, you can directly select "single board-circuit board" → "replication" option. If it is multi-connection board, such as "single board-circuit board" → "multiple replication" → in the pop-up box, you must adjust the horizontal direction to point three arrows, vertical direction to point two arrows, and then the electrode can be determined. No, you will copy six test boxes at the same position, remember here
6. MARK setting must be in "single board-circuit board" → "single board" → select "single board for correction" → correct reference position → "mark center" → first correct with B (beta) → shape → color parameter → generally MARK is red, and note: before each mark point is made, be sure to re-select "correct reference position" → "mark center". note: if "select model comparison" → "fail to obtain reference position" appears in mark component test, check whether the parameter "check reference" → "correct mark" → "shape" is selected.
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