3D Inspection Online AOI EKT-VL-200M

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3D Inspection Online AOI EKT-VL-200M


● Standard 12 million-pixel full-color high-speed industrial digital camera, giving priority to ensuring high efficiency, high quality and high stability, and restoring real and natural image effects.

● DLP structured light 3D technology to achieve stable and accurate height detection

● Windows10 x64 operating system, software architecture in 64-bit system, data processing speed to geometric level doubling.

● GPU independent hardware processing images, abandoning the traditional CPU software processing images, so that the CPU full-time to do non-image computing work, balance the efficiency of the computer.

● Standard telecentric lens, high resolution, ultra-wide depth of field, ultra-low distortion and unique parallel light design can clearly image the upturned and tall components of the circuit board without strabismus.

● Intelligent programming, intelligent algorithm, fast intelligent programming, no manual intervention, low requirements for programmers, easy to learn, fast programming speed, high detection rate, high PASS pass-through rate and low false positives.

● Flexible and mobile maintenance station and SPC inquiry terminal. Using mobile terminal under wireless network, one-to-many modes can be used to set up stations at any position in the workshop. One maintenance station can confirm the detection data of multiple online machines, so as to save personnel and accurately prompt the exact defect name, supported by perfect SQL database system, provide SPC statistical analysis system in the form of pie chart and histogram to facilitate customers to carry out process analysis and quality improvement.

● Convenient use of off-line programming software OLP, because it can obtain PCB whole board images and store them in full memory, it can realize efficient off-line programming without differentiation between on-line and off-line.

 

detection ability

Applicable process

SMT after solder paste printing, SMT before/after reflow, DIP before/after wave soldering

Programming mode

Manual writing, automatic writing, CAD data import automatic corresponding component library, two sides of independent programming

Detection type

Solder paste printing: with or without, offset, less tin, more tin, open circuit, even tin, pollution, scratches, etc.

Defects of parts: missing parts, multiple parts, offset, skew, monument erection, side erection, turnover, wrong parts, damage, reverse direction, XY offset, etc.

Defects of solder joints: more tin, less tin, virtual soldering, tin connection, glue overflow, pin failure, tin bead detection, copper foil contamination, etc.

3D measurement: visible object height or depth (20mm range) measurement, specified height range object length and width and area measurement.

calculation method

3D point cloud reconstruction, AI deep learning, color operation, vector analysis, color extraction, gray scale operation, feature analysis, OCV/OCR, etc.

Detection mode

Monorail automatic board feeding, application of optimized detection technology covering the entire circuit board, support for board splicing and multi-mark, including Bad mark function.

SPC statistical function

The whole process of recording test data and statistics and analysis, any area can view the production status and quality analysis.

Part angle

Support 0-359 degree rotation, minimum 1 angle distance.

MINIMUM PARTS

01005 chip、0.3 pitch IC

Optical configuration

Camera

12 million Pixel Customized Full Color High Speed Industrial Digital Camera

Lens Resolution

10um/15um/18um/20um/25um, can be customized for special applications

Light source

Autonomously configurable annular stereo multi-channel color light, depending on the application to choose RGB/RGBW/RGBR/RWBR, optional coaxial light source

 

 

3D Module

DLP Quantity

4 DLP

Working angle

30 (depending on DLP model)

Height measurement range

20mm (different calibration according to different testing requirements)

Height measurement accuracy

±10um

Computer

Operating System

Windows 10 64

Display

22 inches, 16:10

VGA

Intel HD integrated graphics (optional discrete graphics)

CPU

Intel i7 series or equivalent

GPU

Standard

RAM

64GB

HDD

1TB Above mechanical hard disk, optional solid state hard disk

software system

Interface Language

Chinese and English optional interface

Operation permission

Administrator, programmer, operator three-level login authority control

Mechanical system

Delivery and inspection methods

Automatic board entry and exit, optional L-R/R-L, stepping motor to transport PCB and adjust width track, XY servo motor to drive camera to take pictures respectively.

Track Width Adjustment

Automatic

Splint way

automatic fixture

PCB Dimensions

50*50mm(Min)~ 510*510mm(Max), can be customized for special applications

PCB thickness

0.3~5.0mm

PCB Weight

Max:3KG

PCB Board Edge

3mm, special applications can be customized

PCB Bending

<5mm or 3% of PCB diagonal length

PCB part height

Top:35mm,Bottom:35mm. Adjustable, special applications can be customized

XY drive system

AC servo motor, precision grinding ball screw

XY movement speed

Max:830mm/s

XY positioning accuracy

≦ 8um

Whole machine parameters

Overall dimension of equipment

L1430 * W1250 * H 1600 mm (height without signal lamp)

Power

AC220V,50/60Hz,2.0KW

PCB height above ground

900±20mm

Equipment weight

1500KG

Front and rear equipment communication

Spema

Air pressure requirements

0.4 - 0.8 MPa

Equipment safety regulations

Conform to CE safety standards

Ambient temperature and humidity

10~35 ℃,35 ~ 80% RH (no condensation)

Optional

Maintenance Station System, Off-line Programming System, SPC Server System, Bar Code Identification System, MES Interface

 

Online Inquiry

If you want to consult our products, please fill in the form below, we will get in touch with you the first time!

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